Substrate processing apparatus and nozzle
US10580669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2017 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | Feb 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
After a discharge of a processing liquid is stopped, a position of a liquid surface within a nozzle can be observed. A substrate processing apparatus includes a substrate holding mechanism and the nozzle. The substrate holding mechanism is configured to hold a substrate. The nozzle is configured to supply the processing liquid to the substrate. The nozzle includes a pipe member and an observation window. The pipe member has a horizontal part and a downward part extended downwards from the horizontal part, and is configured to discharge the processing liquid from a tip end of the downward part. The observation window is provided at the horizontal part of the pipe member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.