Apparatus for wire handling and embedding on and within 3D printed parts
US10582619B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2016 |
| Grant date | Mar 3, 2020 |
| Priority date | — |
| Expiry date | May 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus, system, and method for automatically dispensing and embedding components into three-dimensional parts. In an example embodiment, a direct wire embedding head can be fixed on an automation motion system. The direct wire embedding head begins and terminates an embedded wire pattern on a layer or on a surface of a three-dimensional part in order to automatically create the embedded wire pattern. A sensor is located on an embedding surface wherein the embedded wire pattern is embedded. The sensor can measure the distance between the direct wire embedding head and the embedding surface. A predefined distance can be maintained to ensure successful embedding results for the embedded wire pattern by automatically adjusting a position of the direct wire embedding head in response to feedback from the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.