Patent · US Active

Method for polymer-assisted chip transfer

US10586725B1 · kind B1 · utility

2Cited by

37References

20Claims

0Family size

Assignee

Facebook Technologies, LLC · US

Inventors

Pooya Saketi · Cork, IE
Oscar Torrents Abad · Cork, IE
Allan Pourchet · Cork, IE
Patrick J. Hughes · Cork, IE
Karsten Moh · Riegelsberg, DE
Daniel Brodoceanu · Cork, IE

Key dates

Filing date	Jan 10, 2018
Grant date	Mar 10, 2020
Priority date	—
Expiry date	Mar 8, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/825
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.