Patent · US Active

Chip carrier configured for delamination-free encapsulation and stable sintering

US10586756B2 · kind B2 · utility

3Cited by

7References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alexander Roth · Griesheim, DE
Andreas Grassmann · Villach, AT
Juergen Hoegerl · Regensburg, DE
Angela Kessler · Regensburg, DE

Key dates

Filing date	Oct 3, 2017
Grant date	Mar 10, 2020
Priority date	—
Expiry date	Oct 3, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip carrier for carrying an electronic chip, wherein the chip carrier comprises a mounting section configured for mounting an electronic chip by sintering, and an encapsulation section configured for being encapsulated by an encapsulant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.