Semiconductor device modules including a die electrically connected to posts and related methods
US10586780B2 · kind B2 · utility
1Cited by
12References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2019 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Apr 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor device modules may include a semiconductor die and posts located laterally adjacent to the semiconductor die. A first encapsulant may laterally surround the semiconductor die and the posts. Electrical connectors may extend laterally from the posts, over the first encapsulant, to bond pads on an active surface of the semiconductor die. A protective material may cover the electrical connectors. A second encapsulant may cover the protective material and the electrical connectors. The second encapsulant may be in direct contact with the first encapsulant, the electrical connectors, and the protective material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.