Electronic package structure
US10587037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Apr 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/243
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.