Yude Chu
8Patents
1h-index
18Co-inventors
44Inventor score
Filing activity: Aug 18, 2001 → Apr 8, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6781222B2 | Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof | Electricity | 17 | Expired |
| US9289846B2 | Method for fabricating wire bonding structure | Electricity | 0 | Active |
| US9355989B2 | Wire bonding device and method of eliminating defective bonding wire | Electricity | 0 | Active |
| US9502758B2 | Electronic package and fabrication method thereof | Electricity | 0 | Active |
| US9997477B2 | Method of manufacturing semiconductor package | Electricity | 0 | Active |
| US9337250B2 | Semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
| US10587037B2 | Electronic package structure | Electricity | 0 | Active |
| US9502377B2 | Semiconductor package and fabrication method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.