Stacked structure and method for manufacturing the same
US10588214B2 · kind B2 · utility
0Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2019 |
| Grant date | Mar 10, 2020 |
| Priority date | — |
| Expiry date | Aug 18, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.