Heat exchanger for regulating surface temperature of a polishing pad, polishing apparatus, polishing method, and medium storing computer program
US10589398B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Sep 17, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2210/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A heat exchanger which can allow a surface temperature of a polishing pad to promptly reach a target temperature and can realize a uniform distribution of the surface temperature of the polishing pad is disclosed. The heat exchanger includes a pad contact surface capable of contacting the polishing pad, a heating flow passage through which a heating fluid is to flow, and a cooling flow passage through which a cooling fluid is to flow. The heating flow passage and the cooling flow passage are arranged side by side from beginnings to ends thereof, and the heating flow passage and the cooling flow passage cross each other at different levels at a peripheral portion of the pad contact surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.