Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof
US10593629B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Jul 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a conductive casing, a semiconductor die, a conductive connector, an insulating encapsulant, a redistribution structure, and a first conductive terminal. The conductive casing has a cavity. The semiconductor die is disposed in the cavity of the conductive casing. The conductive connector is disposed on a periphery of the conductive casing. The insulating encapsulant encapsulates the conductive connector, the semiconductor die and the cavity. The redistribution structure is formed on the insulating encapsulant and is electrically connected to the conductive connector and the semiconductor die. The first conductive terminal is disposed in openings of the redistribution structure and is physically in contact with a portion of the conductive casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.