Inventor · Hengshan, TW

Li-Chih Fang

16Patents
4h-index
20Co-inventors
56Inventor score

Filing activity: Aug 15, 2007 → Feb 4, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7619305B2 Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking Emerging Cross-Sectional Technologies 22 Active
US9761568B2 Thin fan-out multi-chip stacked packages and the method for manufacturing the same Electricity 9 Active
US7927919B1 Semiconductor packaging method to save interposer Electricity 8 Active
US10593629B2 Semiconductor package with a conductive casing for heat dissipation and electromagnetic interference (EMI) shield and manufacturing method thereof Electricity 5 Active
US9831219B2 Manufacturing method of package structure Electricity 4 Active
US7691676B1 Mold array process for semiconductor packages Electricity 3 Active
US8304917B2 Multi-chip stacked package and its mother chip to save interposer Electricity 3 Active
US10607860B2 Package structure and chip structure Electricity 2 Active
US10276510B2 Manufacturing method of package structure having conductive shield Electricity 1 Active
US10431549B2 Semiconductor package and manufacturing method thereof Electricity 1 Active
US10840200B2 Manufacturing method of chip package structure comprising encapsulant having concave surface Electricity 1 Active
US9659911B1 Package structure and manufacturing method thereof Electricity 1 Active
US9825010B2 Stacked chip package structure and manufacturing method thereof Electricity 1 Active
US10163834B2 Chip package structure comprising encapsulant having concave surface Electricity 0 Active
US9972554B2 Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof Electricity 0 Active
US10950557B2 Stacked chip package structure and manufacturing method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.