Multi-device packages and related microelectronic devices
US10593637B2 · kind B2 · utility
1Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Mar 17, 2020 |
| Priority date | — |
| Expiry date | Aug 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip and a plurality of first connectors. The two device regions are formed from the substrate, and the first redistribution layer is disposed on the substrate and electrically connected to the two device regions. The external chip is disposed on the first redistribution layer, and the first connectors are interposed between the first redistribution layer and the external chip to interconnect the two.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.