Metrology apparatus, lithographic system, and method of measuring a structure
US10599047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2018 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | May 24, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A metrology apparatus is disclosed that measures a structure formed on a substrate to determine a parameter of interest. The apparatus comprises an optical system configured to focus radiation onto the structure and direct radiation after reflection from the structure onto a detector, wherein: the optical system is configured such that the detector detects a radiation intensity resulting from interference between radiation from at least two different points in a pupil plane field distribution, wherein the interference is such that a component of the detected radiation intensity containing information about the parameter of interest is enhanced relative to one or more other components of the detected radiation intensity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.