Position measuring method, position measuring apparatus, and semiconductor device manufacturing method
US10599056B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2019 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Jan 31, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/5446
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
According to one embodiment, in a position measuring method, alignment measurement in a light exposure process is executed by irradiating a first mark with light having a wavelength of λ1, with respect to a processing object that includes a first layer and a second layer stacked above a substrate and a resist applied on the second layer. The first mark is provided in the first layer and includes a plurality of segments arranged at a pitch smaller than a resolution limit given by light having the wavelength of λ1. Then, overlay measurement is executed by irradiating the first mark and a second mark with light having a wavelength of λ2 shorter than the wavelength of λ1. The second mark has been formed by performing a light exposure and development process to the resist, and includes a plurality of segments arranged at the pitch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.