Electronic device comprising a support substrate and an encapsulating cover for an electronic component
US10600704B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 17, 2018 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Sep 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.