Roseanne Duca
7Patents
2h-index
7Co-inventors
36Inventor score
Filing activity: Sep 19, 2013 → Sep 12, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9449912B1 | Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming | Electricity | 7 | Active |
| US9620438B2 | Electronic device with heat dissipater | Electricity | 3 | Active |
| US10600704B2 | Electronic device comprising a support substrate and an encapsulating cover for an electronic component | Electricity | 2 | Active |
| US9257372B2 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Emerging Cross-Sectional Technologies | 1 | Active |
| US11443958B2 | Semiconductor device and corresponding method | Electricity | 0 | Active |
| US12148628B2 | Semiconductor device and corresponding method | Electricity | 0 | Active |
| US10892201B2 | Electronic device comprising a support substrate and an encapsulating cover for an electronic component | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.