Electronic package and method for fabricating the same
US10600708B2 · kind B2 · utility
2Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Oct 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and a method for fabricating the same are provided. The method includes disposing on a carrier an electronic component having a plurality of conductors, encapsulating the electronic component with an encapsulant, and disposing an electronic device on the encapsulant. The electronic device and the carrier are electrically connected through the conductors, thereby reducing the overall thickness of the electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.