Patent · US Active

Package base core and sensor package structure

US10600829B2 · kind B2 · utility

0Cited by

3References

8Claims

0Family size

Assignee

KINGPAK TECHNOLOGY INC. · TW

Inventors

Chung-Hsin Hsin · Baoshan, TW
Chen Peng · 東區, TW
Chien LIN · Baoshan, TW
KUN-CHIH HSIEH · Tangxia, CN

Key dates

Filing date	Jul 24, 2017
Grant date	Mar 24, 2020
Priority date	—
Expiry date	Aug 16, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper, a second stopper, a sensing member, a first compound, a second compound, and a translucent member. The stopper (or the first and second stoppers) of the present disclosure is provided to form with a protruding portion on the substrate, so that an overflowing of the compound can be avoided, thereby increasing the reliability of the package base core.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.