Inventor · 東區, TW

Chen Peng

17Patents
6h-index
37Co-inventors
66Inventor score

Filing activity: Apr 16, 2001 → Mar 18, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US6400007B1 Stacked structure of semiconductor means and method for manufacturing the same Electricity 65 Expired
US6472736B1 Stacked structure for memory chips Electricity 33 Expired
US6642137B2 Method for manufacturing a package structure of integrated circuits Electricity 11 Expired
US7423334B2 Image sensor module with a protection layer and a method for manufacturing the same Electricity 10 Active
US7554599B2 Image sensor module with air escape hole and a method for manufacturing the same Electricity 8 Active
US7598580B1 Image sensor module package structure with supporting element Electricity 6 Active
US10868062B2 Sensor package structure Electricity 2 Active
US11133348B2 Sensor package structure and sensing module thereof Electricity 2 Active
US6642554B2 Memory module structure Emerging Cross-Sectional Technologies 1 Expired
US10411055B2 Sensor package structure Electricity 1 Active
US9184331B2 Method for reducing tilt of optical unit during manufacture of image sensor Electricity 1 Active
US8004602B2 Image sensor structure and integrated lens module thereof Electricity 1 Active
US8450137B2 Method for reducing tilt of transparent window during manufacturing of image sensor Electricity 0 Active
US7235869B2 Integrated circuit package having a resistant layer for stopping flowed glue Electricity 0 Expired
US11735562B2 Sensor package structure Electricity 0 Active
US6501187B1 Semiconductor package structure having central leads and method for packaging the same Electricity 0 Expired
US10600829B2 Package base core and sensor package structure Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.