Sensor package structure
US10600830B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2017 |
| Grant date | Mar 24, 2020 |
| Priority date | — |
| Expiry date | Dec 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically connected to the substrate and the sensor chip, a transparent layer facing the sensor chip, a support disposed on the substrate, and a packaging compound disposed on the substrate and covering side edges of the support and the transparent layer. A part of each wire is embedded in the support. A height from the upper surface of the substrate to the top of the support is larger than a height from the upper surface of the substrate to the top of any of the wires. The bottom surface of the transparent layer has a central region facing the sensor chip and a ring-shaped supporting region surrounded by the central region. The support is arranged outside the sensor chip and abuts against the supporting region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.