Jo-Wei Yang
8Patents
3h-index
14Co-inventors
46Inventor score
Filing activity: Feb 13, 2013 → Apr 22, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8969120B2 | Two-stage packaging method of image sensors | Electricity | 10 | Active |
| US9905597B2 | Sensor package structure | Electricity | 5 | Active |
| US10340250B2 | Stack type sensor package structure | Electricity | 4 | Active |
| US9184331B2 | Method for reducing tilt of optical unit during manufacture of image sensor | Electricity | 1 | Active |
| US10720370B2 | Sensor package structure | Electricity | 1 | Active |
| US8703519B1 | Structure and manufacturing method for high resolution camera module | Emerging Cross-Sectional Technologies | 0 | Active |
| US10600830B2 | Sensor package structure | Electricity | 0 | Active |
| US10825851B2 | Sensor package structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.