Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrate
US10604839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2015 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Jan 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32051
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing apparatus, including: a processing chamber having a first and a second processing regions; a substrate mounting table rotatably installed in the processing chamber on which a substrate is mounted, and a rotation instrument configured to rotate the substrate mounting table such that the substrate passes through the first processing region and the second processing region in this order, at least one of the first and the second processing regions including: a gas supply part including a line-shaped opening portion extending in a radial direction of the substrate mounting table and configured to supply a gas from the opening portion into the region; and a gap holding member protruding from a ceiling of the processing chamber opposing the substrate, around the opening portion, toward the substrate such that a space on the substrate has a predetermined gap to serve as a passage of the supplied gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.