Substrate structure with selective surface finishes for flip chip assembly
US10607960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Mar 31, 2020 |
| Priority date | — |
| Expiry date | Apr 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a substrate structure with selective surface finishes used in flip chip assembly, and a process for making the same. The disclosed substrate structure includes a substrate body, a metal structure with a first finish area and a second finish area, a first surface finish, and a second surface finish. The metal structure is formed on a top surface of the substrate body, the first surface finish is formed over the first finish area of the metal structure, and the second surface finish is formed over the second finish area of the metal structure. The first surface finish is different from the second surface finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.