Robert Hartmann
7Patents
2h-index
8Co-inventors
36Inventor score
Filing activity: Nov 30, 2010 → Apr 5, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9269887B1 | Ultrathin flip-chip packaging techniques and configurations | Electricity | 8 | Active |
| US8680683B1 | Wafer level package with embedded passive components and method of manufacturing | Electricity | 4 | Active |
| US9646857B2 | Low pressure encapsulant for size-reduced semiconductor package | Electricity | 2 | Active |
| US9935066B2 | Semiconductor package having a substrate structure with selective surface finishes | Electricity | 1 | Active |
| US9169536B2 | Process for providing noble metal-containing mixtures for recovering noble metals | Emerging Cross-Sectional Technologies | 1 | Active |
| US10283480B2 | Substrate structure with selective surface finishes for flip chip assembly | Electricity | 0 | Active |
| US10607960B2 | Substrate structure with selective surface finishes for flip chip assembly | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.