Substrate processing apparatus, injector, and substrate processing method
US10619247B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Nov 16, 2017 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Apr 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
There is provided a substrate processing apparatus, including: a process vessel configured to accommodate a plurality of substrates; a gas supply part configured to supply a gas into the process vessel; an exhaust part configured to exhaust the gas in the process vessel; and a scavenging part configured to scavenge an interior of the gas supply part, wherein the gas supply part is connected to the scavenging part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.