Manufacturing method for electronic component
US10619261B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2018 |
| Grant date | Apr 14, 2020 |
| Priority date | — |
| Expiry date | Mar 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for an electronic component according to an aspect of the present invention includes: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; forming a mask made of an organic resin layer on the second metal layer; performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer; performing oxygen ashing treatment on an inner surface of the recess portion; and forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.