Integrated circuit die with in-chip heat sink

US10629512B2 · kind B2 · utility

Assignee

• XILINX, INC. · US

Inventors

• Hong-Tsz Pan · Cupertino, US
• Jonathan Chang · Laurel, US
• Nui Chong · San Jose, US
• Henley Liu · San Jose, US
• Gamal Refai-Ahmed · Markham, CA
• Suresh Ramalingam · Fremont, US

Key dates

• Filing date: Jun 29, 2018
• Grant date: Apr 21, 2020
• Expiry date: Jun 29, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2225/06589
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus are provided that includes an integrated circuit die having an in-chip heat sink, along with an electronic device and a chip package having the same, and methods for fabricating the same. In one example, an integrated circuit die has an in-chip heat sink that separates a high heat generating integrated circuit from another integrated circuit disposed within the die. The in-chip heat sink provides a highly conductive heat transfer path from interior portions of the die to at least one exposed die surface.