Semiconductor device package and method of manufacturing the same
US10629519B2 · kind B2 · utility
5Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2016 |
| Grant date | Apr 21, 2020 |
| Priority date | — |
| Expiry date | Dec 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes an electronic device, a conductive frame and a first molding layer. The conductive frame is disposed over and electrically connected to the electronic device, and the conductive frame includes a plurality of leads. The first molding layer covers the electronic device and a portion of the conductive frame, and is disposed between at least two adjacent ones of the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.