Sheng-Ming Wang
33Patents
5h-index
27Co-inventors
69Inventor score
Filing activity: Jul 24, 1998 → Dec 6, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7550375B2 | Method for forming metal bumps | Electricity | 11 | Active |
| US5964014A | Structure of an environmental friendly coffin | Human Necessities | 8 | Expired |
| US10157887B2 | Semiconductor device package and method of manufacturing the same | Electricity | 8 | Active |
| US8884443B2 | Substrate for semiconductor package and process for manufacturing | Electricity | 5 | Active |
| US10629519B2 | Semiconductor device package and method of manufacturing the same | Electricity | 5 | Active |
| US10049893B2 | Semiconductor device with a conductive post | Electricity | 4 | Active |
| US10446411B2 | Semiconductor device package with a conductive post | Electricity | 4 | Active |
| US10573624B2 | Semiconductor device package and method of manufacturing the same | Electricity | 4 | Active |
| US10134683B2 | Semiconductor device package and method of manufacturing the same | Electricity | 3 | Active |
| US7637129B2 | Air jet pressurized clothes washing machine | Textiles; Paper | 2 | Active |
| US10224298B2 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Electricity | 1 | Active |
| US9984989B2 | Semiconductor substrate and semiconductor package structure | Electricity | 1 | Active |
| US10515884B2 | Substrate having a conductive structure within photo-sensitive resin | Electricity | 1 | Active |
| US9224707B2 | Substrate for semiconductor package and process for manufacturing | Electricity | 1 | Active |
| US9911702B2 | Semiconductor package structure and fabrication method thereof | Electricity | 1 | Active |
| US9486150B2 | Method of signal enhancement for ECG devices | Human Necessities | 0 | Active |
| US8686568B2 | Semiconductor package substrates having layered circuit segments, and related methods | Electricity | 0 | Active |
| US10103110B2 | Semiconductor package structure and fabrication method thereof | Electricity | 0 | Active |
| US9437532B2 | Substrate for semiconductor package and process for manufacturing | Electricity | 0 | Active |
| US12328564B2 | Method and apparatus for performing audio enhancement with aid of timing control | Electricity | 0 | Active |
| US8649852B2 | Method of signal enhancement for ECG devices | Human Necessities | 0 | Active |
| US8592962B2 | Semiconductor device packages with protective layer and related methods | Electricity | 0 | Active |
| US10879159B2 | Substrate, semiconductor package thereof and process of making same | Electricity | 0 | Active |
| US10002843B2 | Semiconductor substrate structure, semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
| US9054118B2 | Heat dissipating semiconductor device packages and related methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.