Patent · US Active

Power mesh-on-die trace bumping

US10629731B2 · kind B2 · utility

0Cited by

2References

19Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Bernd Waidhas · Nittendorf, DE
Sonja Koller · Regensburg, DE
Georg Seidemann · Landshut, DE

Key dates

Filing date	Mar 11, 2019
Grant date	Apr 21, 2020
Priority date	—
Expiry date	Mar 11, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10D30/0221
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power mesh-on-die apparatus includes a solder trace that enhances current flow for a power source trace between adjacent power bumps. The solder trace is also applied between power drain bumps on a power drain trace.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.