Piezoelectric package-integrated temperature sensing devices

US10634566B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Feras Eid · Chandler, US
• Sasha N. Oster · Chandler, US
• Georgios Dogiamis · Chandler, US
• Thomas L. Sounart · Chandler, US
• Adel A. Elsherbini · Chandler, US
• Shawna M. Liff · Scottsdale, US
• Johanna M. Swan · Scottsdale, US

Key dates

• Filing date: Jun 30, 2016
• Grant date: Apr 28, 2020
• Expiry date: Aug 28, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.