Thomas L. Sounart
30Patents
2h-index
31Co-inventors
49Inventor score
Filing activity: Apr 1, 2016 → Oct 4, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9902152B2 | Piezoelectric package-integrated synthetic jet devices | Performing Operations; Transporting | 3 | Active |
| US11016288B2 | Adaptable displays using piezoelectric actuators | Electricity | 2 | Active |
| US11223524B2 | Package integrated security features | Electricity | 2 | Active |
| US10921349B2 | Piezoelectric package-integrated current sensing devices | Electricity | 1 | Active |
| US10251272B2 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Electricity | 1 | Active |
| US10594029B2 | Actuatable and adaptable metamaterials integrated in package | Electricity | 1 | Active |
| US11302618B2 | Microelectronic assemblies having substrate-integrated perovskite layers | Electricity | 1 | Active |
| US10969574B2 | Process for creating piezo-electric mirrors in package | Electricity | 0 | Active |
| US10386204B2 | Integrated sensor and homologous calibration structure for resonant devices | Physics | 0 | Active |
| US11756948B2 | In situ package integrated thin film capacitors for power delivery | Electricity | 0 | Active |
| US11804455B1 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Electricity | 0 | Active |
| US12255225B2 | Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes | Electricity | 0 | Active |
| US12389728B2 | Micro-LED displays including solder structures and methods | Electricity | 0 | Active |
| US10937594B2 | Microelectronic devices designed with ultra-high-k dielectric capacitors integrated with package substrates | Electricity | 0 | Active |
| US12349282B2 | Capacitors in through glass vias | Electricity | 0 | Active |
| US10634566B2 | Piezoelectric package-integrated temperature sensing devices | Electricity | 0 | Active |
| US10116504B2 | Package integrated security features | Electricity | 0 | Active |
| US11908687B2 | III-N multichip modules and methods of fabrication | Electricity | 0 | Active |
| US10721568B2 | Piezoelectric package-integrated acoustic transducer devices | Electricity | 0 | Active |
| US10644616B2 | Piezoelectric package-integrated motor | Physics | 0 | Active |
| US10649158B2 | Alignment of single and multi-mode optical fibers using piezoelectric actuators | Physics | 0 | Active |
| US10969576B2 | Piezo actuators for optical beam steering applications | Physics | 0 | Active |
| US11495552B2 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Electricity | 0 | Active |
| US12119435B2 | Semiconductor smoothing apparatus and method | Electricity | 0 | Active |
| US10816733B2 | Piezoelectrically actuated mirrors for optical communications | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.