Micro sensor package and manufacturing method of micro sensor package
US10634634B2 · kind B2 · utility
1Cited by
3References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 12, 2017 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Jun 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is a microsensor package. Particularly, disclosed is a microsensor package, in which a sensing chip is packaged by using PCBs stacked on top of one another, whereby the thickness of the package slim can be kept slim, and at the same time, it can be manufactured at a low cost and can be easily manufactured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.