Bum Mo AHN
88Patents
3h-index
13Co-inventors
59Inventor score
Filing activity: Feb 5, 2007 → May 24, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7777137B2 | Device and method for transmitting shape information of image through tactile sensation using rheological fluid | Physics | 13 | Active |
| US10886446B2 | Micro LED structure and method of manufacturing same | Electricity | 4 | Active |
| US10015841B2 | Micro heater and micro sensor and manufacturing methods thereof | Electricity | 3 | Active |
| US11145788B2 | Micro LED transfer head | Electricity | 3 | Active |
| US9559276B2 | LED metal substrate package and method of manufacturing same | Electricity | 2 | Active |
| US10840115B2 | Micro LED transfer head | Electricity | 2 | Active |
| US10615064B2 | Transfer head for micro LED | Electricity | 2 | Active |
| US9865787B2 | Chip substrate and chip package module | Electricity | 2 | Active |
| US9559268B2 | Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method | Emerging Cross-Sectional Technologies | 2 | Active |
| US10241094B2 | Micro heater, micro sensor and micro sensor manufacturing method | Electricity | 2 | Active |
| US11696398B2 | Anodic aluminum oxide structure, probe head having same, and probe card having same | Electricity | 1 | Active |
| US11691387B2 | Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same | Chemistry; Metallurgy | 1 | Active |
| US9496470B2 | Chip package having a light shield | Electricity | 1 | Active |
| US10634634B2 | Micro sensor package and manufacturing method of micro sensor package | Electricity | 1 | Active |
| US11497126B2 | Multilayer wiring board and probe card including same | Electricity | 1 | Active |
| US9768369B2 | LED metal substrate package and method of manufacturing same | Electricity | 1 | Active |
| US11581210B2 | Micro LED transfer system | Electricity | 1 | Active |
| US10872828B2 | Inspection and replacement method for micro LED | Electricity | 1 | Active |
| US10533253B2 | Fluid permeable anodic oxide film and fluid permeable body using anodic oxide film | Performing Operations; Transporting | 1 | Active |
| US9018651B2 | Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof | Electricity | 1 | Active |
| US10193207B2 | Substrate for supporting antenna pattern and antenna using same | Electricity | 1 | Active |
| US10658549B2 | Unit substrate for optical device and optical device package having same | Electricity | 1 | Active |
| US9374890B2 | Chip substrate having a lens insert | Electricity | 1 | Active |
| US10707394B2 | Micro LED structure and method of manufacturing same | Electricity | 1 | Active |
| USD1030689S1 | Semiconductor probe pin | General | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.