Patent assignee · KR · COMPANY

POINT ENGINEERING CO., LTD.

99Patents
98Active
99Granted
54Portfolio score

Filing activity: Mar 30, 2011 → May 24, 2024 · 1 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US8921879B2 Optical device and method for manufacturing same Electricity 5 Active
US10886446B2 Micro LED structure and method of manufacturing same Electricity 4 Active
US11145788B2 Micro LED transfer head Electricity 3 Active
US10015841B2 Micro heater and micro sensor and manufacturing methods thereof Electricity 3 Active
US9865787B2 Chip substrate and chip package module Electricity 2 Active
US10241094B2 Micro heater, micro sensor and micro sensor manufacturing method Electricity 2 Active
US10840115B2 Micro LED transfer head Electricity 2 Active
US9559268B2 Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method Emerging Cross-Sectional Technologies 2 Active
US9559276B2 LED metal substrate package and method of manufacturing same Electricity 2 Active
US10615064B2 Transfer head for micro LED Electricity 2 Active
US10658549B2 Unit substrate for optical device and optical device package having same Electricity 1 Active
US10533253B2 Fluid permeable anodic oxide film and fluid permeable body using anodic oxide film Performing Operations; Transporting 1 Active
US11696398B2 Anodic aluminum oxide structure, probe head having same, and probe card having same Electricity 1 Active
US10634634B2 Micro sensor package and manufacturing method of micro sensor package Electricity 1 Active
US11691387B2 Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same Chemistry; Metallurgy 1 Active
US10707394B2 Micro LED structure and method of manufacturing same Electricity 1 Active
US11581210B2 Micro LED transfer system Electricity 1 Active
US9374890B2 Chip substrate having a lens insert Electricity 1 Active
USD1030689S1 Semiconductor probe pin General 1 Active
US11497126B2 Multilayer wiring board and probe card including same Electricity 1 Active
US10872828B2 Inspection and replacement method for micro LED Electricity 1 Active
US9378986B2 Method for mounting a chip and chip package Electricity 1 Active
US9768369B2 LED metal substrate package and method of manufacturing same Electricity 1 Active
US9281452B2 Method for manufacturing a can package-type optical device, and optical device manufactured thereby Electricity 1 Active
US9018651B2 Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof Electricity 1 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.