Semiconductor die assemblies with heat sink and associated systems and methods
US10636678B2 · kind B2 · utility
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13References
20Claims
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Key dates
| Filing date | Nov 28, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Nov 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming semiconductor die assemblies with heat transfer features are disclosed herein. In some embodiments, the methods comprise providing a wafer having a first side and a second side opposite the first side, attaching a semiconductor die stack to the first side of the wafer, and forming a plurality of heat transfer features at the second side of the wafer. The heat transfer features can be defined by a plurality of grooves that define an exposed continuous surface of the wafer at the second side compared to a planar surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.