Semiconductor fins with dielectric isolation at fin bottom
US10636709B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2018 |
| Grant date | Apr 28, 2020 |
| Priority date | — |
| Expiry date | Apr 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/85
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is presented for forming dielectric isolated fins. The method includes forming a plurality of fin structures over a semiconductor substrate, forming spacers adjacent each of the plurality of fins, recessing the semiconductor substrate to form bottom fin profiles, and forming shallow trench isolation (STI) regions between the plurality of fins and the bottom fin profiles. The method further includes etching the STI regions, a select number of the plurality of fins, and a portion of a select number of the bottom fin profiles to create cavities between a mechanical anchor defined between a pair of fins of the plurality of fins, the etching resulting in undercutting of remaining fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.