Jay William Strane
40Patents
7h-index
71Co-inventors
72Inventor score
Filing activity: Jun 6, 2002 → Jan 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7041571B2 | Air gap interconnect structure and method of manufacture | Electricity | 52 | Expired |
| US8421077B2 | Replacement gate MOSFET with self-aligned diffusion contact | Electricity | 32 | Active |
| US8188574B2 | Pedestal guard ring having continuous M1 metal barrier connected to crack stop | Electricity | 17 | Active |
| US8101518B2 | Method and process for forming a self-aligned silicide contact | Electricity | 10 | Active |
| US6887785B1 | Etching openings of different depths using a single mask layer method and structure | Electricity | 9 | Expired |
| US7544610B2 | Method and process for forming a self-aligned silicide contact | Electricity | 9 | Expired |
| US6809027B2 | Self-aligned borderless contacts | Electricity | 8 | Expired |
| US8299455B2 | Semiconductor structures having improved contact resistance | Electricity | 7 | Active |
| US6989317B1 | Trench formation in semiconductor integrated circuits (ICs) | Electricity | 7 | Expired |
| US6806177B2 | Method of making self-aligned borderless contacts | Electricity | 6 | Expired |
| US8685809B2 | Semiconductor structures having improved contact resistance | Electricity | 5 | Active |
| US8039382B2 | Method for forming self-aligned metal silicide contacts | Chemistry; Metallurgy | 5 | Active |
| US7618891B2 | Method for forming self-aligned metal silicide contacts | Chemistry; Metallurgy | 4 | Active |
| US9666474B2 | Uniform dielectric recess depth during fin reveal | Electricity | 3 | Active |
| US7790553B2 | Methods for forming high performance gates and structures thereof | Electricity | 3 | Active |
| US7601646B2 | Top-oxide-early process and array top oxide planarization | Electricity | 2 | Active |
| US10535550B2 | Protection of low temperature isolation fill | Electricity | 1 | Active |
| US9984935B2 | Uniform dielectric recess depth during fin reveal | Electricity | 1 | Active |
| US10636709B2 | Semiconductor fins with dielectric isolation at fin bottom | Electricity | 1 | Active |
| US11043429B2 | Semiconductor fins with dielectric isolation at fin bottom | Electricity | 0 | Active |
| US12310090B2 | CMOS top source/drain region doping and epitaxial growth for a vertical field effect transistor | Electricity | 0 | Active |
| US9984916B2 | Uniform dielectric recess depth during fin reveal | Electricity | 0 | Active |
| US11217692B2 | Vertical field effect transistor with bottom spacer | Electricity | 0 | Active |
| US11251287B2 | Self-aligned uniform bottom spacers for VTFETS | Electricity | 0 | Active |
| US12183740B2 | Stacked field-effect transistors | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.