Patent · US Active

Method of forming an electronic package

US10636746B2 · kind B2 · utility

0Cited by

7References

12Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Kamal K. Sikka · Poughkeepsie, US
Krishna R. Tunga · Wappingers Falls, US
Hilton T. Toy · Hopewell Junction, US
Thomas Weiss · Poughkeepsie, US
Shidong Li · Poughkeepsie, US
Sushumna Iruvanti · Wappingers Falls, US

Key dates

Filing date	Feb 26, 2018
Grant date	Apr 28, 2020
Priority date	—
Expiry date	Feb 26, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/2018
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.