Pre-treatment method to improve selectivity in a selective deposition process

US10643889B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• Dennis M. Hausmann · Lake Oswego, US
• Elham Mohimi · Hillsboro, US
• Pengyi Zhang · Tigard, US
• Paul C. Lemaire · Portland, US
• Kashish Sharma · Fremont, US
• Alexander R. Fox · Portland, US
• Nagraj Shankar · Tualatin, US
• Kapu Sirish Reddy · Portland, US
• David Charles Smith · Lake Oswego, US

Key dates

• Filing date: Aug 6, 2018
• Grant date: May 5, 2020
• Expiry date: Aug 6, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76883
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of improving selectivity of a metal in a selective deposition process. A pre-treatment process for the metal modifies the metal surface, and includes first reducing the metal to remove organic contamination from the metal followed by oxidation of the metal to allow a monolayer of a metal oxide to grow on the surface. This modification of the metal allows inhibitor molecules to adsorb on the metal oxide monolayer to improve selectivity.