Patent · US Active

Magnetic phase change material for heat dissipation

US10643917B2 · kind B2 · utility

0Cited by

2References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Roesner · Villach, AT
Christoph Bergmann · Markkleeberg, DE

Key dates

Filing date	Sep 21, 2018
Grant date	May 5, 2020
Priority date	—
Expiry date	Oct 8, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/73265
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component includes an electronic chip and a magnetic phase change material configured to consume energy when changing between different magnetic phases in response to heating above a phase change temperature. The phase change material is thermally coupled with the electronic chip to thereby dissipate heat from the electronic chip upon heating up to or above the phase change temperature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.