Inventor · Villach, AT

Michael Roesner

28Patents
4h-index
42Co-inventors
59Inventor score

Filing activity: Jun 8, 2001 → May 30, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US9496193B1 Semiconductor chip with structured sidewalls Electricity 27 Active
US9673096B2 Method for processing a semiconductor substrate and a method for processing a semiconductor wafer Electricity 21 Active
US6633379B2 Apparatus and method for measuring the degradation of a tool Physics 14 Expired
US6752694B2 Apparatus for and method of wafer grinding Performing Operations; Transporting 9 Expired
US10032670B2 Plasma dicing of silicon carbide Electricity 4 Active
US9704748B2 Method of dicing a wafer Electricity 2 Active
US9610543B2 Method for simultaneous structuring and chip singulation Emerging Cross-Sectional Technologies 1 Active
US9368436B2 Source down semiconductor devices and methods of formation thereof Electricity 1 Active
US8815706B2 Methods of forming semiconductor devices Electricity 1 Active
US10157765B2 Methods for processing a semiconductor workpiece Electricity 1 Active
US10186458B2 Component and method of manufacturing a component using an ultrathin carrier Electricity 0 Active
US9059273B2 Methods for processing a semiconductor wafer Electricity 0 Active
US11195713B2 Methods of forming a silicon-insulator layer and semiconductor device having the same Electricity 0 Active
US10373868B2 Method of processing a porous conductive structure in connection to an electronic component on a substrate Electricity 0 Active
US10020264B2 Integrated circuit substrate and method for manufacturing the same Electricity 0 Active
US10622218B2 Segmented edge protection shield Electricity 0 Active
US9449876B2 Singulation of semiconductor dies with contact metallization by electrical discharge machining Electricity 0 Active
US10643917B2 Magnetic phase change material for heat dissipation Electricity 0 Active
US9793129B2 Segmented edge protection shield Electricity 0 Active
US11063014B2 Semiconductor devices including a metal silicide layer and methods for manufacturing thereof Electricity 0 Active
US10672716B2 Integrated circuit substrate and method for manufacturing the same Electricity 0 Active
US11367654B2 Component and method of manufacturing a component using an ultrathin carrier Electricity 0 Active
US11282805B2 Silicon carbide devices and methods for manufacturing the same Electricity 0 Active
US11077525B2 Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber Performing Operations; Transporting 0 Active
US10005659B2 Method for simultaneous structuring and chip singulation Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.