Flexibile interfaces using through-silicon via technology
US10644826B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2018 |
| Grant date | May 5, 2020 |
| Priority date | — |
| Expiry date | Jun 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1437
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes first and second through-silicon via (TSV) circuits and a steering logic circuit. The first TSV circuit has a first TSV and a first multiplexer for selecting between a first TSV data signal received from the first TSV and a first local data signal for transmission to a first TSV output terminal. The second TSV circuit includes a second TSV and a second multiplexer for selecting between a second TSV data signal received from the second TSV and the first local data signal for transmission to a second TSV output terminal. The steering logic circuit controls the first multiplexer to select the first local data signal and the second multiplexer to select the second TSV data signal in a first mode, and the first multiplexer to select the first TSV data signal and the second multiplexer to select the first local data signal in a second mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.