Patent · US Active

Back-end-of-line blocking structures arranged over a waveguide core

US10649140B1 · kind B1 · utility

8Cited by
3References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 4, 2019
Grant dateMay 12, 2020
Priority date—
Expiry dateMar 4, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76843
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Structures including a waveguide core and methods of fabricating a structure including a waveguide core. A back-end-of-line interconnect structure includes a cap layer, an interlayer dielectric layer, and one or more metal features embedded in the interlayer dielectric layer. The interlayer dielectric layer is stacked in a vertical direction with the cap layer. The one or more metal features have an overlapping arrangement in a lateral direction with the waveguide core, which is arranged under the back-end-of-line interconnect structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.