Substrate processing method
US10651012B2 · kind B2 · utility
1Cited by
2References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 14, 2016 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Jan 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing method performed by a substrate processing apparatus is provided. The substrate processing method comprises: setting a magnetic pole on a processing space side of each electromagnet belonging to one of first, second and third electromagnet groups to be different from a magnetic pole on the processing space side of each electromagnet belonging to the other two electromagnet groups; generating an electric field by applying a high frequency power to a lower electrode; and performing a first process on the substrate with plasma generated by the electric field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.