Variable depth edge ring for etch uniformity control
US10651015B2 · kind B2 · utility
4Cited by
54References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2017 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Oct 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate support includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller that calculates a desired pocket depth of the substrate support. Pocket depth corresponds to a distance between an upper surface of the edge ring and an upper surface of the substrate. Based on the desired pocket depth, the controller selectively controls an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.