Apparatus and method of three dimensional conductive lines
US10651114B2 · kind B2 · utility
1Cited by
13References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 18, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | Dec 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B10/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.