Wafer processing apparatus
US10658171B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2019 |
| Grant date | May 19, 2020 |
| Priority date | — |
| Expiry date | Apr 23, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. Accordingly, a uniform shield tunnel composed of a fine hole and an amorphous region surrounding the fine hole can be formed so as to extend from the front side of the wafer to the back side thereof, by one shot of the laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.