Naotoshi Kirihara
14Patents
2h-index
19Co-inventors
47Inventor score
Filing activity: Mar 15, 2005 → Oct 25, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7521671B2 | Laser ionization mass spectroscope | Electricity | 18 | Expired |
| US7585751B2 | Wafer dividing method using laser beam with an annular spot | Electricity | 7 | Active |
| US9761492B2 | Processing method of optical device wafer | Electricity | 2 | Active |
| US10109527B2 | Optical device wafer processing method | Electricity | 2 | Active |
| US10297710B2 | Method of processing wafer | Performing Operations; Transporting | 2 | Active |
| US10388508B2 | Wafer processing apparatus | Performing Operations; Transporting | 1 | Active |
| US9789567B2 | Laser beam spot shape detection method | Performing Operations; Transporting | 1 | Active |
| US11833608B2 | Laser processing method | Performing Operations; Transporting | 0 | Active |
| US12343812B2 | Laser processing apparatus | Performing Operations; Transporting | 0 | Active |
| US10692740B2 | Laser processing apparatus | Performing Operations; Transporting | 0 | Active |
| US10658171B2 | Wafer processing apparatus | Performing Operations; Transporting | 0 | Active |
| US10573559B2 | Laser processing method for wafer | Electricity | 0 | Active |
| US12337412B2 | Laser processing apparatus and laser processing method | Performing Operations; Transporting | 0 | Active |
| US9472459B2 | Wafer divider and wafer division method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.