Patent · US Active

Electronic device

US10658274B2 · kind B2 · utility

0Cited by

1References

14Claims

0Family size

Assignee

Nexperia B.V. · NL

Inventors

Tim Boettcher · Scheeßel, DE
Haibo Fan · Woodbridge, US
Wai Wong Chow · Sai Kung, CN
Pompeo V. Umali · Kwai Chung, CN
Shun Tik Yeung · Kwai Chung, CN
Chi Ho Leung · Kowloon, CN

Key dates

Filing date	Dec 17, 2018
Grant date	May 19, 2020
Priority date	—
Expiry date	Dec 17, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3512
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic device including a die and at least one lead. The electronic device further includes a corresponding at least one connector, each connector for connecting the die to a corresponding lead or leads, and each connector having a first end disposed in bondable proximity to a complementary surface of the corresponding lead and a second end disposed in bondable proximity to a complementary surface of the die. An end portion of at least one of the first end and second end has a formation, the formation in combination with the complementary surface of one, or both, of the respective lead or the die defining therebetween a first region and at least a second region configured to attract by capillary action an electrically conductive bonding material to consolidate therein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.